Test Probe
A test probe is a precision contact component for semiconductor wafer or packaged chip testing, featuring beryllium copper/tungsten spring pins with gold-plated tips for low contact resistance (≤50mΩ) and high durability. Its design includes vertical/cantilever probes, multi-layer ceramic guide plates, and micron-level alignment systems (±5μm), supporting up to 100GHz high-frequency testing and 100K+ contact cycles. Critical for IC mass production, wafer-level reliability verification, and advanced packaging (e.g., 3D IC) with fine-pitch testing (pitch≤40μm).
