Thermal interface thermal conductive material s
Against the rapid development of 5G, the Internet of Things, artificial intelligence, intelligent driving, communication sectors (such as servers and base stations), and storage fields, the market for thermal interface materials is expanding significantly. This is particularly evident in high-performance computing, data centers, and AI computing power domains, where not only higher performance is required of chip heat dissipation materials, but more stringent standards for their reliability and efficiency are also being set.
A shift is occurring in packaging forms: while traditional resin-based encapsulants like thermal greases and gels once dominated, there is now a transition toward using liquid metal sheets and composite phase change materials as the primary heat dissipation materials. The FCBGA chip packaging form – featuring an upper metal heat sink and a lower carrier board – is gradually becoming the mainstream for high-performance chips, including CPUs, GPUs, high-end servers, ASICs for network routers/switchers, MPUs for high-performance game consoles, high-performance ASSPs, FPGAs, and ADAS in in-vehicle devices.
In terms of downstream applications, PCs constitute the largest market, followed by servers, AI chips, 5G base stations, and the automotive sector.
As chip integration and performance continue to improve, power consumption is also on the rise. Electronic components are generating heat at increasingly higher densities; especially in the AI era, CPUs and GPUs need to process more data simultaneously to enhance computing efficiency. For example, NVIDIA’s Blackwell B200 single chip has a power consumption of 1000W, while the GB200 chip – composed of one Grace CPU and two Blackwell GPUs – reaches a power consumption as high as 2700W. Excessively high temperatures reduce electron mobility inside the chip, and when the generated heat cannot be dissipated quickly, it leads to degraded chip performance and even triggers various reliability and safety issues. This poses higher demands on heat dissipation technology. To address this, Hongxun Electronics can provide you with efficient and reliable thermal management solutions.
